Thermaltake Core V51 mid-tower chassis, a new member of the Core Series, which now comes after the launch of Core V71 and Core V1, retaining the curved metal mesh look and delivering an outstanding cooling performance with the compatibility for the extensive DIY/AIO LCS, and the air cooling units that the series has become so very well known for. Core V51 is an enthusiast’s grade mid-tower that creates unprecedented space for high-end hardware and liquid cooling expansion, supporting the latest E-ATX, ATX, Micro ATX motherboards, and all high-end GPU cards.
Designed for gamers, the perforated top panel allows easy heat dissipation and rapid air intake for maximum ventilation. The heightened case-stands at the bottom help to enhance airflow and overall stability during operation. Featuring a transparent side window to offer a direct view of the inner system.
Innovative 5.25” & 3.5” tool-free drive bay design has minimized the hassles of installing/removing. “2 + 5” drive bays with modular drive racks, a typical ratio for accessory and storage devices.
Fully Modular Design
A highly customizable 5.25” & 3.5” drive bay feature enables users to freely interchange the 3.5” hard-drive cages to suit their needs and remove the 5.25” & 3.5” drive bays to gain maximum interior space for advance cooling performance or liquid system build.
Core V51 delivers an outstanding cooling performance, consisting of DIY/AIO liquid cooling systems and air cooling units. Two 120mm intake fans are hidden behind the front dust filter, quietly pushing vast amounts of air over the hard drives and GPUs. The air is then extracted by the third 120mm fan at the rear. Additionally, with the aid of the cable management design guaranteed to take the cooling performance to the next level.
High-end Complete Solution
Core V51 enables users to build a complete high-end system, whilst supporting up to either 420mm radiator liquid cooling, or 200mm case fans, with a long graphic card at the same time, and simultaneously protecting the user’s hardware as well as increasing the CPU’s overclocking potential. Most importantly, it has the capability to deliver an outstanding cooling efficiency throughout the entire case.